軟硬結合板
Ultra thin thickness: 0.20~0.25(4Layer) Tilt : <20um W/B pull strength >6g
HDI 基板
Fine circuit design for any layer blind laser via Dimension shrinkage control ± 0.05mm
High Layer Count
Layer registration < 75um Ultra low Loss available Counterbore depth+/-0.05mm
薄板
Ultra thin thickness: 0.13mm (2Layer) Warpage < 0.5% BT available
特殊製程
Various structures of cavity Tilt: < 20um Embedded circuit Embedded C / R
